Saloma
Inventions may save local and international industries millions.
Philippine mining giant Philex Mining Corporation donated some P50 million to the University of the Philippines last October 8, in ceremonies that shed light on the brain drain happening within the country’s mining industry.
Saloma
The US granted patent to a method that can determine the precise location of defects in an integrated circuit (IC) on June 26, while Taiwan granted patent to a coating technology on March 16.
College of Science dean Caesar A. Saloma, together with Dr. Vincent Daria and Dr. Jelda Jane C. Miranda developed the US-patented invention. The invention permits the generation of high-contrast images of semiconductor sites in an integrated circuit sample. It utilizes the 1-photon beam-induced current (1P-OBIC) image and confocal reflectance image of the sample, both of which are generated simultaneously from one and the same light beam focused on the same sample.
“An IC failure analysis equipment that utilizes our method will be relatively inexpensive to acquire and maintain,” Saloma said.
An IC is a miniaturized electronic circuit consisting mainly of semiconductor devices (transistors and pn junctions) and passive components (capacitor, etc.) manufactured on the surface of a thin substrate of a semiconductor material.
Stressing the importance of ICs in everyday life, Saloma said, “Today, it is quite hard to think of a device, equipment or appliance that does not use a microprocessoran example of an ICfor reliability, accuracy and precision. Even Meralco has replaced its old mechanical power meters with digital ones.”
Ramos at his laboratory
Thus, failure analysis is a critical aspect in the manufacture of IC devices. Before a new IC device is produced commercially, its prototype undergoes failure analysis to determine locations in the IC where defects are most likely to happen.
“Defect detection at the prototype level saves on manufacturing cost and avoids unfavorable IC device reviews,” Saloma said.
Locations where defects can occur are called hotspots or cold spots since their temperatures are hotter or colder than the average IC temperature.
The patented method utilizes the physical phenomenon that when light of a suitable color illuminates a semiconductor material, it causes an electrical current to flow in the material. Thus, an OBIC image of an IC will look brighter than the metal and a defect will contain a dark spot in the OBIC image, meaning no current is flowing.
The scientists first filed for a US Patent (via PCT/PH02/0013) on July 9, 2002 with the title, “Method for generating high contrast images of semiconductor sites via a 1-photon optical beam induced current imaging and confocal reflectance microscopy.” The USPTO issued the patent (US Patent No.7,235,988) last June 26. The patent application process was handled by the UPD Office of the Vice Chancellor for Research and Development and the Villaraza & Angangco Law Offces.
“The patented method is a generic technique that has already led to other derivative applications that we have tested in our research laboratory at the NIP. Widely circulated technology magazines like that Photonics Spectra and MRS Bulletin have featured our research works indicating their potential usefulness in the semiconductor industry,” Saloma pointed out.
He considered the USPTO patent crucial because the US “is the most important single economy in the world at least for the moment.” In addition, it represents the culmination of a long, expensive process that starts with scientific research and development.
The scientists are currently in discussion with parties interested in producing an equipment based on the patented method.
Meanwhile, Taiwan granted patent to Dr. Henry J. Ramos’s “Titanium Nitride Thin Film Formation on Metal Substrate by Chemical Vapor Deposition in A Magnetized Sheet Plasma Source.”
Ramos developed a special way of producing a more economical and effective coating for industrial tools made metals and alloy, through the use of titanium nitride (TiN) coating produced by locally manufactured magnetized sheet plasma source.
Ramos developed the process technology called Plasma Enhanced Chemical Vapor Deposition (PECVD) to derive the TiN. By using the Sheet Plasma Negative Ion Source, the components required for the formation of TiN are separated from the composition of plasma. Nitrogen gas is then added as a reactive gas which creates a chemical reaction, thus producing the TiN coating.
TiN coating increases the surface hardness of tools, protecting them from abrasion and the damaging effects of friction during the industrial process. In addition to its non-stick property, it has an aesthetically pleasing yellow color, and has the ability to maintain the sharpness of tools and provides tools with increased durability, resistance to wear and corrosion, thus prolonging the tools’ lifetime while creating better finishes.
Ramos said other potential applications of the technology include use in aerospace components, automotive parts, broaches, decorative accessories, dental instruments, door hardware, eyeglass frames, firearms components, food processing equipment, hobs, jewelry, marine hardware, medical devices, pharmaceutical equipment, plastic molds, plumbing fixtures, sporting goods, surgical implants and writing instruments.
Patent applications for the TiN coating technology have also been filed in Singapore, Japan, People’s Republic of China, United States and Europe.
—Chi Ibay and MM Parreño